Cogojirali
Tekniki paramɛtɛrɛw .
Low Temperature Co-Fired Ceramic Technology bɛ tali kɛ dingɛw sɔgɔli masin na, k’u fa ni conducteur paste ye, ka sɛbɛnni kɛ, ka pakew kɛ, ani fɛɛrɛ wɛrɛw minnu bɛ kɛ ka ɛntɛrinɛti yɔrɔ wajibiyalenw dilan ka bɔ seramiki sɔgɔlenw na. I n’a fɔ fɛɛrɛ tigɛlen-, LTCC ka baarakɛcogo sugu ka bon kosɛbɛ ani yiriwali sira nafama nataw. A bɛ Kɛ kosɛbɛ baara suguya caman na, i n’a fɔ ɔridinatɛri dɔnniya, mɔbiliko, furakɛli seko ni dɔnko ani sanfɛla.



Ɲininikalan ɲɛminɛcogo
LTCC ka yiriwali siratigɛ ye ka seramiki kasɛti suguya kuraw dilan minnu musaka ka dɔgɔ, minnu ka baara ka bon ani minnu bɛ tiɲɛni kɛ. O seramiki kaseti sigida ninnu bɛ se ka ɛntɛrinɛti minɛnw dilan minnu ka ca ni ɲɔgɔn ye, minnu ka ca ni ɲɔgɔn ye, minnu ka ca ni ɲɔgɔn ye, minnu ka ca ni ɲɔgɔn ye, minnu ka ca ni ɲɔgɔn ye, minnu ka ca ni ɲɔgɔn ye, ani minnu bɛ kɛ ka fɛn fitininw kɛ.



Fɛnɲɛnɛmako taabolo
Punching → Filling → Printing → Stacking → Pressing → Hot Cutting → Co-Fired → Scribing→Kɔrɔbɔli
Fɛn dilannenw daminɛcogo
1,Kɔrɔbɔli fɛnw: Yecogo
Kɔrɔbɔli baarakɛminɛnw : Stereomicroscope
Kɔrɔbɔli fɛɛrɛw: GJB548B Fɛɛrɛ 2032
Technical Index:80% ja yɔrɔw dafalen don
2,Kɔrɔbɔli fɛnw :Dimension bɛɛ lajɛlen
Kɔrɔbɔli baarakɛminɛnw:Vernier Caliper, Ja sumanikɛlan
Kɔrɔbɔli fɛɛrɛw :GJB548B,Fɛɛrɛ 2016
Index technique:
| Minɛn | Filijuru |
| Dimension (yɔrɔ) min bɛ Kɛ | ±0,2 mm ye |
| Warpage (kɛlɛbolo) | Be Suprior ka 3% . |
| Kɔlɔsili | ±0,1 mm ye |
3,Sɛgɛsɛgɛli fɛnw: Membrane Adhesion
Kɔrɔbɔli baarakɛminɛnw:3M610 Kaseti nɔrɔlen
Kɔrɔbɔli kɛcogo: ASTM B571-97 Kasɛti sɛgɛsɛgɛli fɛɛrɛ
Index technique : 40X microscope (mikɔrɔskɔpu 40X) kɔrɔ, peeling phenomenon tɛ membrane layer kan cogo si la
4,Kɔrɔbɔli fɛnw:High Temperature Resistance of the Membrane Layer
Kɔrɔbɔli baarakɛminɛnw: Hot Stage
Kɔrɔbɔli kɛcogo :Aw bɛ to degere 400 la miniti 10 kɔnɔ
Technical Index:Ni 40X mikroskɔpu bɛ a la, a ɲɛ tɛ kɛ, a ɲɛ bɛ bɔ, a bɛ kurukuru, walima a ɲɛkisɛ tɛ kɛ membrane layer kan cogo si la
5,Index Technique wɛrɛw
| Minɛn | Index technique (Index technique) ye |
|
Ka tɛmɛ Dingɛ Diameter fɛ |
0,2 mm,0,15 mm |
|
Punching Position Tiɲɛni |
±10 µm |
| Stacking Tiɲɛni | ±10 µm |
|
Printing Layini min ka fin kosɛbɛ |
75 µm |
|
Filimu janya tiɲɛni |
±2 µm |
| Bond (Jɛɲɔgɔnya fanga). |
>3 g(25 μm Diamètre Sanu jiri) |
| Film Adhesion (Film Nɔrɔli). | <0,5 kg/mm2 |
| Layɛrɛw Hakɛ | 5~30 Layɛrɛw |
Microcircuit Centre (Microcircuit (Microcircuit) yɔrɔ).
Microcircuit Center sigira senkan san 2022, ni ɲinini yɛrɛmahɔrɔnyalenw ni kɛnɛyako jɛkafɔ baaraw ye. Industri dɔnnikɛlaw bɛ jɛkulu ɲɛminɛ walasa ka kɛ fɛɛrɛ ɲinini ni yiriwali baara minnu bɛ tali kɛ o ko la. O baarakɛda in ka saniyaso ye mɛtɛrɛ kɛrɛnkɛrɛnnen 1500 ye ani fɛɛrɛko ɲinini ni yiriwali jɛkulu min ka ca ni mɔgɔ tan ye, ni izini-fɛɛrɛko seko ɲɛmɔgɔw ye. Microcircuit santiri in jɔra ni LTCC (Low Temperature Co fired Ceramic)Seramik dilanni sira ye, punching, printing, laminating, laminating, co firing, cutting ani baara wɛrɛw minnu bɛ tali kɛ o la. O waati kelen na, filimu finmanw dilanni sira fana bɛ yen ni taabolo dafalenw ye i n’a fɔ sɔgɔsɔgɔninjɛ, fototalan, ani kuran, minnu bɛ se ka filimu finmanw ciriw dilanni kɛcogo kɔrɔw ni DPC fɛnw ta.
Tags hot .: low temperature co-fired ceramic, China low temperature co-fired seramiki dilannikɛlaw, feerekɛlaw, izini
Tɛmɛnen
Kunnafoni si tɛ sɔrɔ .Aw ye ɲininkali ci .











